Hot Chips 2026: Samsung and HBM Base Die Opportunities

HBM, or High Bandwidth Memory, stacks multiple DRAM dies on top of a base die. The dies interface with each other via TSVs, while the base die talks with whatever compute die is using the memory via an interposer. Increasing bandwidth for a new HBM generation involves scaling up bandwidth between the DRAM dies and the base die, as well as scaling bandwidth from the base die to the host. Denser TSVs and more TSVs can easily achieve the former. The latter is more challenging, because the physical ...